200G QSFP56 Passive DAC Cable, 26/30 AWG Twinax Copper, Up to 5m

The 200G QSFP56 Passive DAC Cable is a low-power twinax copper interconnect supporting 200Gbps-class PAM4 connectivity for 200G Ethernet and InfiniBand 4x HDR applications. Available in 26/30 AWG configurations and lengths up to 5m, it combines optimized signal integrity with flexible high-density deployment.

SKU DAC-200GQSFP56-P1 Category
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The 200G QSFP56 Passive Direct Attach Copper (DAC) Cable is a high-speed twinax copper interconnect designed for 200Gbps Ethernet and InfiniBand 4x HDR applications. Featuring QSFP56 connectors on both ends, the cable uses eight differential copper pairs organized into four high-speed channels, with each channel supporting up to 56Gbps PAM4 signaling. This architecture provides 200G-class connectivity with very low power consumption, making the cable an efficient solution for short-distance, high-bandwidth network connections.

Designed to address the tighter signal-integrity requirements of PAM4 transmission, the cable uses an optimized construction to reduce insertion loss and crosstalk. Available in 26 AWG and 30 AWG configurations and lengths up to 5m, it provides flexibility for different rack layouts and cable-management requirements. The cable is suitable for data centers, high-performance computing, networking, and telecommunications environments where high bandwidth, low latency, and power efficiency are essential.
Cable TypePassive Twinax Copper
Connector ConfigurationQSFP56 to QSFP56
Form FactorQSFP56
Aggregate Data RateUp to 200Gbps
Maximum Data Rate212.5Gbps
SignalingPAM4
Number of Channels4
Data Rate per ChannelUp to 56Gbps
Differential Pairs8
Cable ConductorCopper
Available Wire Gauge26 AWG / 30 AWG
Available LengthUp to 5m
Minimum Bending Radius47mm / 35mm
Power Consumption≤0.1W
Cable JacketPVC (OFNR)
Application200G Ethernet / InfiniBand 4x HDR
Protocol / Interface ComplianceSFF-8432 | SFF-8472 | SFF-8661 | SFF-8636
IEEE ComplianceIEEE 802.3bj | IEEE 802.3cd
Signal IntegrityOptimized for Low Insertion Loss and Crosstalk
Latch TypePull-to-Release Slide Latch
CompatibilityGeneric
Operating Temperature0°C to +70°C
Storage Temperature-40°C to +75°C
  • Supports aggregate data rates up to 200Gbps using PAM4 signaling
  • QSFP56 to QSFP56 passive twinax copper configuration
  • Four high-speed transmission channels
  • Eight differential copper pairs
  • Supports up to 56Gbps per channel
  • Designed for 200G Ethernet and InfiniBand 4x HDR applications
  • Compatible with IEEE 802.3bj and IEEE 802.3cd
  • Optimized construction for low insertion loss and crosstalk
  • Available in 26 AWG and 30 AWG configurations
  • Cable lengths available up to 5m
  • Very low power consumption of ≤0.1W
  • Pull-to-release slide latch for convenient installation and removal
  • QSFP56 mating interface compatible with the QSFP family form factor
  • Generic compatibility for supported networking platforms
  • Suitable for high-density rack environments
  • Commercial operating temperature of 0°C to +70°C
  • 200G Ethernet switch-to-switch connections
  • InfiniBand 4x HDR networks
  • High-performance computing (HPC)
  • AI and accelerated computing infrastructure
  • Data center spine-to-leaf interconnects
  • High-density rack-level networking
  • Server and storage interconnects
  • Data center network upgrades
  • Telecommunications infrastructure
  • Short-distance 200G network connections

OEM and customized 200G QSFP56 DAC solutions are available for network equipment manufacturers, system integrators, distributors, and large-scale data center deployments. Customization options may include cable length, conductor gauge, jacket construction, labeling, packaging, branding, and other project-specific requirements.

For high-volume deployments, cable assemblies can be evaluated according to the target switch or server platform, required transmission distance, rack layout, and signal-integrity requirements. Customers can provide equipment models and project specifications for compatibility and configuration recommendations.

Why does this 200G DAC use PAM4 signaling?

PAM4 allows more bits to be transmitted per electrical symbol than traditional two-level signaling, enabling higher data rates without simply doubling the physical channel count. For this cable, PAM4 enables each of the four channels to operate at up to 56Gbps, providing 200G-class aggregate bandwidth.

Why are insertion loss and crosstalk particularly important for 200G DACs?

PAM4 uses multiple signal levels with smaller voltage margins than conventional NRZ signaling. As a result, the transmission path is more sensitive to loss, reflections, noise, and crosstalk. The cable’s optimized twinax construction is therefore important for maintaining signal quality at 200G speeds.

What is the difference between 26 AWG and 30 AWG versions?

AWG selection affects cable diameter, flexibility, and electrical characteristics. The 26 AWG version generally provides a more robust conductor structure and can be advantageous for certain longer or demanding configurations, while 30 AWG offers a slimmer and more flexible cable design that can simplify cable management in dense racks.

Is this cable compatible with QSFP+ ports?

The QSFP56 connector shares the established QSFP mechanical mating interface, but mechanical compatibility does not guarantee operational compatibility. The host equipment must support the required QSFP56 data rate, PAM4 signaling, and applicable 200G operating mode.

What is the maximum cable length?

The standard specification supports cable lengths up to 5m. The practical maximum depends on the selected AWG, cable construction, host equipment, and required signal-integrity performance. Shorter cables are generally preferred for the most demanding high-density 200G applications.

Why is the power consumption so low?

This is a passive copper cable and does not contain active optical transmitters, receivers, or signal-processing circuitry. The passive architecture therefore requires very little power compared with active optical solutions, making it attractive for high-density data center deployments where overall rack power and thermal load are important considerations.