As AI workloads drive data center networks toward 800G, 1.6T, and beyond, optical interconnects must deliver higher bandwidth density while addressing power, thermal, and space constraints. This article explores the differences between XPO (eXtra-dense Pluggable Optics) and CPO (Co-Packaged Optics), examining their architectures, advantages, challenges, and potential applications in next-generation data centers. It also explains how XPO extends the pluggable optics model while CPO takes a more deeply integrated approach to optical connectivity.
